The Chemical Bond III

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The series Structure and Bonding publishes critical reviews on research related to chemical structure and bonding, covering the entire Periodic Table and addressing issues linked to all elements. It emphasizes emerging areas in structural and theoretical chemistry, including nanostructures, molecular electronics, designed molecular solids, surfaces, metal clusters, and supramolecular structures. The series encompasses physical and spectroscopic techniques for determining and modeling structures, focusing on scientific results rather than technical details. It also explores the development of bonding models and generalizations that illuminate reactivity pathways and rates of chemical processes. Each volume is thematic, aiming to provide a comprehensive overview of areas with emerging insights of interest to a broader scientific audience. Reviews within the volume critically survey specific aspects of the topic and contextualize them within the volume. Significant developments from the last 5 to 10 years are highlighted through selected examples. While not exhaustive, the coverage is conceptual, focusing on new principles to help non-specialists understand the data presented. Future research directions in the area are encouraged, and review articles are invited by the volume editors.