Cuprous is key to acceleration in Copper bottom up filling

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Focusing on the innovative use of Copper in semiconductor wiring, this book delves into the technology of electrodeposition for fine cavities in chip wiring. It explores the significant industrial applications of Copper Damascene processes, including through silicon vias and printed wiring boards. The text provides a fundamental review of Copper electrodeposition, discussing the role of additives and the mechanisms behind cuprous acceleration. This comprehensive guide aims to enhance understanding and application of these techniques in the semiconductor industry.