More-than-Moore 2.5D and 3D SiP Integration

Focusing on the challenges of microelectronics in the post Moore's Law era, this book explores technical tradeoffs in architecture and manufacturing related to 2.5D and 3D integration technologies. It examines the implications of disruptive technology options, including the roles of Integrated Device Manufacturers, Fabless companies, Foundries, and Outsourced Assembly and Test services. Aimed at IC product teams, it provides insights into leveraging More-than-Moore technology for future microelectronic products, making it an essential resource for navigating this evolving landscape.