More-than-Moore 2.5D and 3D SiP Integration

Focusing on the challenges in microelectronics beyond Moore's Law, this book offers a comprehensive analysis of 2.5D and 3D integration technologies. It explores technical tradeoffs from architecture to manufacturing, while addressing business and product management implications of disruptive technologies. Key discussions include the dynamics between Integrated Device Manufacturers, Fabless companies, Foundries, and Outsourced Assembly and Test services. It serves as an essential resource for IC product teams looking to innovate with More-than-Moore technology options.